A revolutionary chip design paradigm that replaces monolithic SoC (System-on-Chip) with interconnected modular “chiplets” – specialized semiconductor dies that perform specific functions (CPU, GPU, memory controller, I/O). These chiplets are manufactured on different process nodes optimized for their specific workloads, then integrated into a single package using advanced interconnect technologies like UCIe (Universal Chiplet Interconnect Express). Chiplet architecture addresses the limitations of Moore’s Law by enabling higher performance, improved yield rates, and reduced development costs. Major semiconductor companies including AMD, Intel, and NVIDIA have adopted chiplet designs for their high-end processors, with AMD’s EPYC server chips demonstrating 40% higher performance per watt compared to monolithic alternatives. The global chiplet market is projected to reach $57 billion by 2030, with applications spanning data centers, AI accelerators, and automotive computing systems.